Mill-Max Interconnect Components

July 19, 2013
1 min read

Mill-Max has been manufacturing and designing precision-machined interconnect components for over 40 years. Mill-Max’s products are manufactured in their US plant with the use of proprietary high speed turning machines. These automated machines enable precise production and extreme quality control with tolerances less than +/- 0.0005”.

With a wide array of components, Mill-Max offers an extensive line including:

Spring loaded connectors
SIP, DIP, BGA and PLCC sockets
Board-to-board interconnects and pin headers
PCB pins
Receptacles and Solder Terminals

All products are available in SMT and through-hole.

Innovative Mill-Max Products at TCH

SMT headers with .030" (0,76mm) Diameter Pins

Perfect for creating a secure surface mount interconnect between two printed circuit boards.

Ultra-Low Profile Spring-Loaded Connectors
	Only 0.100" in height, the trend towards miniaturization in electronics demands smaller interconnects that deliver high quality performance.

0.050" (1,27mm) & 0.100" (2,54mm) Grid SMT Z-Bend Sockets and Headers

Designed to create a surface mount interconnect between two printed circuit boards. These products are ideal for placement near the board edge and for pluggable adapter modules which can sit perpendicular to the motherboard, conserving precious board real estate.

BGA Socket and BGA Adapter Systems

BGA Socket/Adapter Systems to fit 1mm, 0.05" and 0.8"mm grid footprints. They provide a high density and low profile interconnect system.